| 摘要 |
PURPOSE:To improve reliability by a method wherein a lead frame for a glass- sealed type semiconductor device is provided with through-holes at the glass- embedded part of the leads. CONSTITUTION:The lead frame is formed in a square with a four-sided frame 1, and leads 2 are connected to two opposite sides of the frame 1 right and left in symmetrical arrangement. Further, the leads have the tips extended so as to form the space for pellet mounting of mainly square form at the center of the lead frame. Then, a through-hole 3 is provided at the glass-embedded part of the extension of an outer lead to the pellet side so-called a short lead 2a. Such a construction enables the short leads 2a not only to come into contact with the glass only on the surface of the glass-embedded part, but to be mechanically fixed because of glass connection via through-holes, at the time of hermetically sealing the package by heat-fusion of low melting point glass. |
