| 摘要 |
PURPOSE:To improve an ageing stability by bonding a conductor foil on the surface of a metal substrate, and forming by etching a circuit pattern. CONSTITUTION:After a conductor foil 14 coated with an insulating varnish 15 is bonded by a filmlike thermosetting adhesive 16 onto the surface of a metal substrate 13, it is then heated to cure the adhesive 16. Subsequently, a circuit pattern 10 is formed by etching. Since the filmlike adhesive is used to bond the substrate 13 and the foil 14, the entire substrate formed with the pattern 10 has high flexibility. |
