| 摘要 |
PURPOSE:To make it possible to manufacture the device at a low cost with functions and reliability being maintained, by providing a lead frame, which is formed by blanking or etching a plate member, wherein part of copper, whish is applied on aluminum or aluminum alloy, is exfoliated and part of the aluminum or aluminum alloy is exposed. CONSTITUTION:A plate member is prepared as follows: both surfaces of a central member 1 comprising aluminum or aluminum alloy are coated by fine particles of copper; and copper films 2 and 2' are applied on the surfaces of the central member 1 by sintering at about the eutectic point temperature of Al- Cu. The copper film 2 on one side of the parts, which are to be formed into an inner lead part and a semiconductor-chip mounting part at the surface of said plate member, is exfoliated so that square parts 3 are formed by etching and the like. The aluminum or the aluminum alloy 1 in the inside is exposed. Then the copper film part and the part of the member 1 comprising the aluminum in the square part 3 other than the required part are blanked by a press. Said part is continued to the copper film part. A series of the lead frames, in which unit lead frames are continued in a belt shape, is formed in this way.
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