发明名称 SOFT SOLDER FLUX
摘要 PURPOSE:To improve corrosion resistance by incorporating specific weight % of dimethylformamide and viscosity imparting agent such as high molecular polysaccharide into a water soluble zinc chloride flux. CONSTITUTION:3-10% Dimethylformamide and 0.8-4% viscosity imparting agent consisting of high molecular polysaccharide such as D-mannite are incorporated into the water soluble zinc chloride flux. The corrosion resistance of the soft solder is largely improved by the dimethylformamide incorporated therein without deteriorating the joining characteristic of said metal and the deterioration of said metal with elapse of time owing to corrosion is decreased. The high molecular polysaccharide is required to be incorporated therein at 0.8% as a lower limit in order to render the necessary viscosity to the soft solder. The joining characteristic in the case of using the conventional inorg. flux is assured and the corrosion resistance is improved by the above-mentioned method.
申请公布号 JPS60240399(A) 申请公布日期 1985.11.29
申请号 JP19840097270 申请日期 1984.05.15
申请人 TOSHIBA KK 发明人 NAKAMURA KISAKU;JIMI EIJI;KAGAMI HIDEYO
分类号 H05K3/34;B23K35/36;B23K35/363;C09J1/00 主分类号 H05K3/34
代理机构 代理人
主权项
地址