| 摘要 |
The high temperature stability of devices encapsulated with a flame retardant epoxy molding compound is improved by including in the encapsulant as synergistic flame retardant a halogen-containing organic compound (preferably of the reactive type) and antimony pentoxide. The encapsulant may be prepared from an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, the halogen-containing organic compound (which may be part of the resin or the hardener) and antimony pentoxide. Such encapsulants, when used to encapsulate semiconductor devices, have improved high temperature compatability compared to similar molding compounds with antimony trioxide or antimony tetraoxide. |
