发明名称 |
Plating bath compositions for electroless plating of metals and metal alloys |
摘要 |
The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallisation of display applications. |
申请公布号 |
EP3034650(A1) |
申请公布日期 |
2016.06.22 |
申请号 |
EP20140198380 |
申请日期 |
2014.12.16 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
BRUNNER, HEIKO, DR.;KOHLMANN, LARS;KARASAHIN, SENGÜL;DAMMASCH, MATTHIAS, DR.;PAPE, SIMON;LUCKS, SANDRA |
分类号 |
C23C18/34;C23C18/36;C23C18/40;C23C18/48;C23C18/50 |
主分类号 |
C23C18/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|