| 摘要 |
PURPOSE:To permit attaching and detaching of a semiconductor substrate without damaging the substrate by forming guiding grooves to the inside and outside of a recessed part for contg. the semiconductor substrate of a supporting body introducing or taking out a chuck of an automatic transmporting mechanism into or out of the guiding groove, and taking out the semiconductor substrate by holding the external periphery of the semiconductor substrate. CONSTITUTION:A recessed part 8 for contg. a semiconductor substrate 9 is formed in a supporting body 1, and guiding grooves 20 are formed over the whole part of the inside and outside of the recess 8 for contg. the substrate. Further, an automatic transporting mechanism provided with a chuck capable of executing lifting and swirling freely is installed separately. When a semiconductor substrate 9 contained in the recesssed part 8 is taken out, the chuck of the automatic transporting mechanism and the semiconductor substrate 9 are positioned, and each part 22 of the chuck is introduced into the guiding groove 20 of the recessed part 8, respectively by dropping each chuck. Each chuck part 22 is moved, then, toward inside to hold the external periphery of the semiconductor substate 9, then, the semiconductor substrate 9 is taken out by lifting the chuck.
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