| 摘要 |
The present invention relates to a thermosetting resin composition which is used in electronic devices or circuit board used therefor such as multi-layered printing substrates and build up substrates. The present invention further relates to a plate-shaped body including the same. More specifically, the present invention relates to a thermosetting resin composition which includes 0.1-80 parts by weight of an inorganic filler with respect to 100 parts by weight of a thermosetting resin, wherein the inorganic filler is hydrophobized. The present invention further relates to a plate-shaped body including the same and other uses thereof. The thermosetting resin composition of the present invention has excellent strength, low-temperature expansibility, heat resistance, and enough high-frequency characteristics while maintaining the high-frequency characteristics for a long time. The thermosetting resin composition also exhibits economic feasibility and processability, thereby being suitable to be used as electronic devices or members thereof. |
