| 摘要 |
PURPOSE:To elevate a connecting strength even without the reinforcement by adhesive, etc. by connecting the thin film metallic terminal of a magnetic sensor and a waveform shaping circuit with heating and pressurizing the sensor pattern side rather than the center of the thin film metallic terminal. CONSTITUTION:A flexible printed circuit F consisting of a copper foil 6A and plastic 7A is opposed to a magnetic sensor S forming a thin film metallic terminal 4 provided thereon with a solder 5A on a glass substrate 1A, the upper part of which is covered by a sensor pattern 2. The circuit F and sensor S are bonded by the solder 5A and connected with heating and pressurizing centering around a point A near the inside of L/4 from a point C of the center of the length L of the terminal of the sensor S by a heater tip 8A having shorter width W than the length L of the terminal of sensor S. A magnetic sensor device having an excellent practical effect can be thus obtd. |
