SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can increase intervals among a plurality of semiconductor chips without deteriorating handleability of a semiconductor chip.SOLUTION: A semiconductor device manufacturing method comprises: a process of singulating a wafer attached to a first adhesive sheet 10 by dicing to form a plurality of semiconductor chips CP; a process of stretching the first adhesive sheet 10 to increase intervals among a plurality of semiconductor chips CP; a process of transferring the plurality of semiconductor chips CP to a second adhesive sheet 20; a process of removing the first adhesive sheet 10; and a process of stretching the second adhesive sheet 20 to further increase intervals among the plurality of semiconductor chips CP.SELECTED DRAWING: Figure 2