| 摘要 |
<p>A sputter coating source 2 has separate annular targets 6 and 7 spaced outwardly from each other around a central axis. Magnetic field generating means are provided to establish magnetic field lines 31 over each target around an annular path. Each target has its own separate magnetic field generating means including an electromagnet 20 and 22 having a separately controllable power supply 96 and 99 whereby the strength of the magnetic field over each target may be separately controlled. The targets are electrically separated from each other, and each target has a separately controllable power supply 90 and 94 whereby the plasma power for each target may be separately controlled. More than two separate targets may be employed, and the various targets may be positioned at different distances from the substrate 81.</p> |
