LIGHT EMITTING DIODE PACKAGE

摘要

The present invention provides a light emitting diode package. The light emitting diode package includes a package substrate which comprises first and second electrode structures at least partially exposed on a first surface; a light emitting diode chip which has a first electrode and a second electrode attached to the first and second electrode structures; a reflection layer which is arranged on the first surface of the package substrate to be separated from the light emitting diode chip and has a smaller thickness compared to the light emitting diode chip; and a wavelength conversion part which covers at least part of the reflection layer and the light emitting diode chip. The wavelength conversion part has an upper surface which is practically parallel to the first surface of the package substrate; and an inclined lateral surface which faces the upper surface. So, the color quality of the light emitting diode package can be improved.