| 摘要 |
An improved apparatus for plating interior surfaces of electrical terminals that are spaced apart and attached to a carrier strip is disclosed. The apparatus is comprised of strip feeding means which feeds the strip of terminals to a rotating mandrel which guides the terminals through a plating zone while they are plated, a source of electrolytic plating solution, and a source of electrical potential for applying electrical current flow from an anode through the solution to a cathode. The mandrel has a plurality of anode extensions located about its axis of rotation, said anode extensions being movable into and out of the interiors of the terminals that are against the mandrel. The mandrel further has a plurality of nozzles located about its axis of rotation, said nozzle being associated with but separate from said anode extensions. A conduit supplies electrolyte solution under pressure through the nozzles and into the terminals in which the associated anode extensions have been received, the anode extensions being constructed for withdrawal from the terminals prior to those terminals exiting from the mandrel.
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