发明名称 COOLING DEVICE OF SUBSTRATE
摘要 PURPOSE:To enlarge constantly the contacting area of a substrate and a substrate holder and thereby to obtain a device excellent in cooling efficiency, by planting fine wires having elasticity and high thermal conductivity on the surface of the substrate holder contacting with the substrate. CONSTITUTION:A substrate holder 1 is formed of metal, and a circulation channel 3 of cooling water is provided inside the holder. Moreover, fine wires 4 having elasticity and high thermal conductivity are planted on the surface, i.e. the cooling surface, of the holder. The fine wires 4 are constituted by round wires, and a plurality of them are bound into a bundle 5. The substrate 6 is held by the substrate holder 1, while a presser plate 7 presses the substrate 6 from around to make it contact with the substrate holder 1. Pressed by the presser plate 7 from the above, the substrate 6 is made to contact with the substrate holder 1 and then processing of the substrate is started. Although the substrate 6 is heated and tranformed, it is in contact constantly at many points with the substrate holder 1 through the intermediary of the fine wires 4 having elasticity and high thermal conductivity, and thus the heat of the substrate 6 is surely transmitted to the substrate holder 1 through the fine wires 4.
申请公布号 JPS60236223(A) 申请公布日期 1985.11.25
申请号 JP19840091879 申请日期 1984.05.10
申请人 NIPPON SHINKU GIJUTSU KK 发明人 MATSUMOTO TAKASHI
分类号 H01J37/317;H01J37/00;H01J37/20;H01L21/265;H01L23/473 主分类号 H01J37/317
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