| 摘要 |
PURPOSE:To prevent deformation or the like of a carrier and conduct a smooth and highly reliable operation, by minimizing the length of the transporting path between die-boning and wire-bonding processes by means of die-bonding and wire-bonding stages which are provided in close proximity with each other. CONSTITUTION:A lead frame 17 is transported along a transporting path 7. When the frame 17 is positioned in the center of a stage 10, a controller 18 controls an XY table 12 so that a die-bonding tool 13 is positioned directly above a mount section, and die bonding is thereby effected. Thereafter, a die bonder head 3 is turned so that the die-bonding tool 13 reaches a position directly above a die retainer mechanism 5 to catch a predetermined IC die. Meanwhile, the position of a die-bonded pad is detected by a recognition device, and a wire bonder head 4 is turned in response to a signal from the controller 18 so that a wire bonding tool 16 reaches a position directly above the stage 10. In this manner, pads and lead frames are successively subjected to wire bonding. |
