发明名称 |
OXYMETHYLENE POLYMER MOLDING MATERIAL EXCELLENT IN BLACK SPOT FORMING RESISTANCE |
摘要 |
The black speck formation which occurs during the compounding and molding of admixtures of oxymethylene polymers and polyamides having a melting or softening point below that of the oxymethylene polymer can be reduced by adding the polyamide to the oxymethylene polymer as a dispersion of the polyamide in a carrier resin which is inert to the oxymethylene polymer and has a melting or softening point below that of the oxymethylene polymer. The polyamide comprises less than about 50 weight percent of the dispersion. |
申请公布号 |
JPS61101550(A) |
申请公布日期 |
1986.05.20 |
申请号 |
JP19850238569 |
申请日期 |
1985.10.24 |
申请人 |
CELANESE CORP |
发明人 |
ANDORIYUU AUAABATSUKU;KABIRUPARAYAN NATARAJIYAN |
分类号 |
C08L59/00;C08L23/00;C08L23/08;C08L23/26;C08L33/00;C08L33/02;C08L51/00;C08L51/02;C08L59/02;C08L67/00;C08L77/00;C08L101/00 |
主分类号 |
C08L59/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|