发明名称 DELIVERY METHOD OF MASKING TAPE FOR STRIPE PLATING
摘要 PURPOSE:To adhere precisely a masking tape without divergence to the surface of a copper wire by delivering a masking tape in a specified device under fixed tension when a copper wire, etc. is stripe-plated. CONSTITUTION:An electronic part 1 such as a copper or copper alloy wire is transported in the direction as shown by the arrow. Meanwhile, a coil-shaped masking tape 5 is horizontally delivered with a turntable 6 having a simple brake device 7 and adhered to the copper wire 1 with a bonding roll 2 after passing a tension fixing device 3. The masking tape 5 on the plating surface is then released by a tape releasing device 14 which is positioned by a cutter 13. ln this case, the tension fixing device 3 is formed of a tension fixing guide roll 8, a micropowder clutch 11, and its controller 12. Accordingly, the tape 5 is bent to an angle of about 60 deg., and the contact surface with the roll 8 is increased. Consequently, the tape is supplied to the material 1 under stabilized tension, and stably adhered to the material without divergence independent of the brake 7 and the bonding speed of the tape to the material 1.
申请公布号 JPS60234992(A) 申请公布日期 1985.11.21
申请号 JP19840091414 申请日期 1984.05.08
申请人 HITACHI DENSEN KK 发明人 YUMINO SHIGERU;ONODERA TOSHIKATSU;TAKAURA MASAKAZU;NAKANO FUMIO
分类号 C25D5/02 主分类号 C25D5/02
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