发明名称 Heat transfer wall.
摘要 <p>In a perforated heat conductive surface structure having voids (13) under an outer surface (10) and openings (16) in the outer surface (10), in order to obtain a high performance in particular at a low pressure and low temperature region, there is provided a heat transfer wall in which a thickness of a wall at a ceiling of each void and a length of a passage (15) of the respective openings (16) are increased in predetermined ranges.</p>
申请公布号 EP0161391(A2) 申请公布日期 1985.11.21
申请号 EP19850101452 申请日期 1985.02.11
申请人 HITACHI, LTD.;HITACHI CABLE, LTD. 发明人 NAKAYAMA, WATARU;NAKAJIMA, TADAKATSU;KUWAHARA, HEIKICHI;YASUKAWA, AKIRA;DAIKOKU, TAKAHIRO;YOSHIDA, HIROMICHI
分类号 F28F13/02;F28F1/10;F28F13/00;F28F13/18;(IPC1-7):F28F13/18 主分类号 F28F13/02
代理机构 代理人
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