发明名称 DIFFUSION BONDING
摘要 A diffusion bonding method comprises providing an alloying material at at least one of the joint surfaces of the base metals and heating the joint to cause diffusion and thus bonding. To render this process suitable for heat-resistant superalloys based on Co, Ni, Fe and Ti, there is formed, in advance of the heating an alloy layer containing an additive element or elements having higher diffusion speed than the principal constituent element of the base metal and lower melting point than the base metal. This layer is formed on the joint surface of the base metal. In the heat treatment the additive element diffuses quickly to provide a strong bond. A preferred additive is B.
申请公布号 DE3266929(D1) 申请公布日期 1985.11.21
申请号 DE19823266929 申请日期 1982.07.12
申请人 HITACHI, LTD. 发明人 HARAMAKI, TAKASHI;FUNAMOTO, TAKAO;KOKURA, SATOSHI;INAGAKI, MASAHISA;JIMBOU, RYUTARO;SASAKI, TOSHIMI;NAGAYAMA, KOUSEI
分类号 B23K20/00;B23K20/16;B23K35/00;(IPC1-7):B23K20/16 主分类号 B23K20/00
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