发明名称 |
DIFFUSION BONDING |
摘要 |
A diffusion bonding method comprises providing an alloying material at at least one of the joint surfaces of the base metals and heating the joint to cause diffusion and thus bonding. To render this process suitable for heat-resistant superalloys based on Co, Ni, Fe and Ti, there is formed, in advance of the heating an alloy layer containing an additive element or elements having higher diffusion speed than the principal constituent element of the base metal and lower melting point than the base metal. This layer is formed on the joint surface of the base metal. In the heat treatment the additive element diffuses quickly to provide a strong bond. A preferred additive is B. |
申请公布号 |
DE3266929(D1) |
申请公布日期 |
1985.11.21 |
申请号 |
DE19823266929 |
申请日期 |
1982.07.12 |
申请人 |
HITACHI, LTD. |
发明人 |
HARAMAKI, TAKASHI;FUNAMOTO, TAKAO;KOKURA, SATOSHI;INAGAKI, MASAHISA;JIMBOU, RYUTARO;SASAKI, TOSHIMI;NAGAYAMA, KOUSEI |
分类号 |
B23K20/00;B23K20/16;B23K35/00;(IPC1-7):B23K20/16 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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