发明名称 CONFRONTING TARGET TYPE SPUTTERING APPARATUS
摘要 PURPOSE:To regulate the distribution pattern of a magnetic field around targets by arranging magnetic path members made of a soft magnetic material as paths for magnetic fluxes from magnetic field generating means at the peripheral parts of the fronts of the targets. CONSTITUTION:A pair of targets T1, T2 are placed in the vacuum vessel 10 of a confronting target type sputtering apparatus so that the surfaces T1S, T2S to be sputtered are paralleled and confront each other with a space in-between, and magnets 152, 162 are placed so that the N and S poles confront each other with the targets T1, T2 in-between. Magnetic path members M made of a soft magnetic material as paths for magnetic fluxes from the magnets 152, 162 are arranged at the peripheral parts of the fronts of the targets T1, T2, e.g., at the four corners. Thus, the distribution pattern of a magnetic field around the targets T can be regulated.
申请公布号 JPS60234969(A) 申请公布日期 1985.11.21
申请号 JP19840090991 申请日期 1984.05.09
申请人 TEIJIN KK 发明人 HONJIYOU KAZUHIKO;KINOSHITA KIMIO
分类号 C23C14/34;C23C14/35;(IPC1-7):C23C14/34 主分类号 C23C14/34
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