| 摘要 |
PURPOSE:To enable application of a fine high-density pattern to production of an electronic circuit by incorporating solder particles having the specific grain size smaller than the smallest size of a printed pattern into solder paste. CONSTITUTION:The solder particles consisting of max. 30mu grain size smaller by <=1/10 the smallest size of the printed pattern are incorporated into the solder paste contg. a flux. The solder paste is approximate to the close-packed state and therefore the past can be supplied to a fine wiring pattern as well and the execution of satisfactory soldering even in a reflow state is made possible. |
