| 摘要 |
PURPOSE:To save the power of automatic machine and improve quality of wafer through reduction in amount of liquid to be used by spraying solution from both sides of wafer while wafer is rotated with rotation of hour-glass shaped rollers arranged around circular wafer. CONSTITUTION:A wafer 1 is held by four rollers R1-R4, the roller R1 is given rotation by a motor 4, the wafer 1 and rollers R2-R4 rotate, and the wafer rotates at a rate, for example, of 10-20 turns/min. Meanwhile, solution pressurizing tubes 5 are provided in both sides of wafer 1 and the processing solution is sprayed toward the rotating wafer 1 from many nozzles N provided to such pressurizing tube 5. Thereby, equivalent amount of solution is sprayed to the both sides of wafer 1 and uniform processing is carried out, and moreover amount of solution to be used can be saved. |
