| 摘要 |
PURPOSE:To continue bonding work by a method wherein paste deposited on the side wall of a nozzle supporting the paste is removed with a cleaner before bonding a semiconductor element or wires to electrodes by interposing paste or a viscous substance. CONSTITUTION:A mount 5 with many thick film circuits 1 is carried into place by means of two carrier belts 3 and 4, and IC elements 2 are die bonded to the circuits 1 by being held with a hold lid 8 having holes 9 appointing bonding regions. In this construction, at the same time with the stop of the mount 5, a die-bonding position is fixed by a position recognizer 10, and a dispense nozzle 12 projecting downward out of the device 10 is lowered and made to spout the paste, resulting in die bonding. The paste 13 deposited on the side wall of the nozzle 12 during repetition of these steps is removed by being immersed together with the nozzle 12 in a cleaning box 15 provided on the belt 4 by the use of an X-Y table 11; accordingly, the interruptions of die bonding work are shortened. |
