发明名称 Method for producing water absorbent polyacrylic acid (salt) resin powder, and water absorbent polyacrylic acid (salt) resin powder
摘要 An object of the present invention is to provide a method for producing water absorbent resin powder in which permeability potential (SFC) is improved while a water absorbing rate (FSR) is being kept. The method is a method for producing water absorbent polyacrylic acid (salt) resin powder including the steps of: (i) polymerizing an acrylic acid (salt) monomer aqueous solution; (ii) during or after the step of (i), performing gel grinding of a hydrogel crosslinked polymer obtained by the polymerization, wherein the hydrogel crosslinked polymer has resin solid content of 10 wt % to 80 wt %, and the gel grinding is carried out with gel grinding energy (GGE) of 18 [J/g] to 60 [J/g]; (iii) drying a particulate hydrogel crosslinked polymer obtained by the gel grinding, wherein the drying is performed at 150° C. to 250° C.; and (iv) carrying out a surface treatment to the particulate hydrogel crosslinked polymer thus dried.
申请公布号 US9447203(B2) 申请公布日期 2016.09.20
申请号 US201113639082 申请日期 2011.04.07
申请人 NIPPOM SHOKUBAI CO., LTD. 发明人 Machida Sayaka;Torii Kazushi;Shirai Yoko;Ikeuchi Hiroyuki;Sakamoto Shigeru;Tachi Koji;Nakatsuru Reiko
分类号 B01J20/26;C08F6/00;C08F220/06;C08J3/24;B29B9/06;B29C47/00;B29C47/38;C08F222/10;B29C47/30;B29C47/66;B29C47/92;B29B9/16 主分类号 B01J20/26
代理机构 Casimir Jones, SC 代理人 Casimir Jones, SC
主权项 1. Water absorbent polyacrylic acid (salt) resin having: 95 wt % or more of particles whose diameter is not less than 150 μm and less than 850 μm; logarithmic standard deviation (σζ) of particle size distribution of 0.25 to 0.50; absorption against pressure (AAP) of 20 [g/g] or more; a water absorbing rate (FSR) of 0.30 [g/g/s] or more; a saline flow conductivity (SFC) of 20[×10−7·cm3·s·g−1] or more; and an internal cell ratio of greater than 1.0% to 2.5%, which is calculated by {(real density)−(apparent density)}/(real density)×100, the water absorbent polyacrylic acid (salt) resin containing a polyvalent metal salt.
地址 Osaka JP