发明名称 BONDABLE POLYETHYLENE RESIN COMPOSITION
摘要 PURPOSE:To provide the titled resin compsn. which can be bonded to metal at a low temp. in a short time, consisting of a molten mixture consisting of a modified high-density polyethylene, a modified linear low-density polyethylene and a metallic compd. powder. CONSTITUTION:1-30pts.wt. modified high-density polyethylene (A) contg. 0.05- 2wt% unsaturated carboxylic acid anhydride (e.g. maleic anhydride) component obtd. by melt-modifying a high-density polyethylene having a density of 0.95 or above, 99-70pts.wt. modified linear low-density polyethylene (B) contg. 0.001- 1wt% unsaturated carboxylic acid anhydride component obtd. by melt-modifying a linear low-density polyethylene such as an ethylene/alpha-olefin copolymer having a density of 0.915-0.94 and 0.01-5pts.wt. powder (C) of an oxide or a hydroxide of a Group II metal such as calcium oxide or magnesium hydroxide are mixed together by melting.
申请公布号 JPS60231749(A) 申请公布日期 1985.11.18
申请号 JP19840088782 申请日期 1984.05.02
申请人 SUMITOMO KAGAKU KOGYO KK 发明人 TOYOSHIMA YOSHIKI;TANAKA MOTONORI
分类号 C08K3/22;C08L23/00;C08L23/26;C08L51/00;C08L51/02;C08L51/06;C08L101/00;C09D5/03;C09D123/26;C09D151/00;C09D151/06;C09J123/26;C09J151/00;C09J151/06;D01F6/46 主分类号 C08K3/22
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