发明名称 |
BONDABLE POLYETHYLENE RESIN COMPOSITION |
摘要 |
PURPOSE:To provide the titled resin compsn. which can be bonded to metal at a low temp. in a short time, consisting of a molten mixture consisting of a modified high-density polyethylene, a modified linear low-density polyethylene and a metallic compd. powder. CONSTITUTION:1-30pts.wt. modified high-density polyethylene (A) contg. 0.05- 2wt% unsaturated carboxylic acid anhydride (e.g. maleic anhydride) component obtd. by melt-modifying a high-density polyethylene having a density of 0.95 or above, 99-70pts.wt. modified linear low-density polyethylene (B) contg. 0.001- 1wt% unsaturated carboxylic acid anhydride component obtd. by melt-modifying a linear low-density polyethylene such as an ethylene/alpha-olefin copolymer having a density of 0.915-0.94 and 0.01-5pts.wt. powder (C) of an oxide or a hydroxide of a Group II metal such as calcium oxide or magnesium hydroxide are mixed together by melting.
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申请公布号 |
JPS60231749(A) |
申请公布日期 |
1985.11.18 |
申请号 |
JP19840088782 |
申请日期 |
1984.05.02 |
申请人 |
SUMITOMO KAGAKU KOGYO KK |
发明人 |
TOYOSHIMA YOSHIKI;TANAKA MOTONORI |
分类号 |
C08K3/22;C08L23/00;C08L23/26;C08L51/00;C08L51/02;C08L51/06;C08L101/00;C09D5/03;C09D123/26;C09D151/00;C09D151/06;C09J123/26;C09J151/00;C09J151/06;D01F6/46 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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