发明名称 SEALING METHOD OF FLAT PACKAGE
摘要 PURPOSE:To prevent deterioration in characteristics due to overheating and yield of gas and to obtain highly reliable parts, by heating a metal cap by a high frequency induction heating method, fusing a low melting point glass, and sealing the main body of a package and a cap. CONSTITUTION:A cap 10 is formed by a metal such as 42 alloy. Low melting point glass 11 is applied and formed by welding or a screen printing method. A high frequency heating coil 12 is arranged around the low melting point glass 11 and a high frequency current is made to flow. The high frequency current flows concentratedly at the peripheral part of the cap 10 and Joule's heat is yielded. The glass 11 is fused, and a frame 3 and the cap 10 are fixed. Only a small amount of the high frequency current flows through a lead 5. A bonding agent, which connects elements 9 such as a semiconductor element and a quartz piece, is not heated. Harmful gas is not yielded. Deterioration in characteristics of the elements 9 does not occur.
申请公布号 JPS60231342(A) 申请公布日期 1985.11.16
申请号 JP19840088016 申请日期 1984.04.30
申请人 KANSAI NIPPON DENKI KK 发明人 TSUJIKAWA ISABUROU
分类号 H01L23/02;H01L21/50;H03H3/007 主分类号 H01L23/02
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