发明名称 SUBSTRATE EQUIPPING DEVICE FOR ELECTRON BEAM EXPOSURE
摘要 PURPOSE:To fix a sample with high flatness to a substrate equipping device for electron beam exposure by a method wherein contact needles for conduction are made to come in contact with the back parts of the sample at the positions corresponding to the surface parts of the sample coming in contact with non- metallic materials. CONSTITUTION:Protruding parts 22b to press the resist surface of a sample 21 are provided to a part of the edge of the opening of the window 22a of a press board 22. Non-metallic materials 23 having small adhesion with the resist are provided on the under surfaces of the protruding parts 22b. A supporting board 24 has a circular edge 24a to support the peripheral edge of the sample 21, and penetrating holes 24b are opened at the positions corresponding to the protruding parts 22b. Contact needles 25 for conduction inserted in the penetrating holes 24b, and the tips thereof are made to come in contact with the back of the sample 21. The bases of the needles 25 are screwed to the back of the supporting board 24 according to adjusting screws 26. Accordingly, the sample 21 is fixed having high flatness.
申请公布号 JPS60229335(A) 申请公布日期 1985.11.14
申请号 JP19840085232 申请日期 1984.04.27
申请人 NIPPON DENKI KK 发明人 HONDA TOSHIYUKI
分类号 G03F7/20;H01L21/027;H01L21/30 主分类号 G03F7/20
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