发明名称 Process for soldering wire portions to workpieces, and apparatus for carrying out the process
摘要 The soldering of wire portions to workpieces is often difficult, for example when solder and flux are to be supplied at locations of difficult access and the connection between the wire end and the workpiece is simultaneously to be made by means of a tool by heating. According to the invention, the wire portion is provided with a suitable quantity of solder in a pretreatment phase, and the soldering takes place subsequently. In the associated apparatus, a soldering station is composed of individual workstations, in which cut-to-length or bared wire portions are introduced and brought into the soldering position (I); subsequently, an individual wire portion is fixed axially and the heated soldering wire is pushed onto the wire end and cut off (II); then, the wire portion, including the attached piece of solder, is blown out, the flux of the adhering piece of solder likewise being cooled (III). This results in an automated work operation for soldering the wire ends, which can thereafter be soldered at the desired location on the workpiece with the smallest possible tools (soldering iron). <IMAGE>
申请公布号 DE3417362(A1) 申请公布日期 1985.11.14
申请号 DE19843417362 申请日期 1984.05.10
申请人 SIEMENS AG 发明人 PUTZ,WILHELM
分类号 B23K1/20;B23K3/06;(IPC1-7):B23K1/02 主分类号 B23K1/20
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