| 摘要 |
PURPOSE:To enable stable soldering treatment by applying locally overflowing turns at plural points to the molten solder in a bath tank and bringing a body to be treated into contact with the molten solder in the overflowing region. CONSTITUTION:The molten solder 1 is filled in the tank 2. Flowing regions of flow rates v1, v2, v3 are formed to the molten solder by plural pumps 3 and guide plates 4 for overflowing by which the molten solder 1 is turned so as to overflow. The body 5 to be treated for soldering is moved at a speed (u) in an arrow direction and is brought into contact with each flowing region of the molten solder 1. The flow rate of the molten solder 1 in each flowing region is set at ¦-v1¦<¦u¦, v2=u, v3>u. The soldering treatment for mounting electronic parts to a printed wiring or thick film circuit board to be used for electronic apparatus is thus stably executed. |
