发明名称 BALL FORMING DEVICE OF BONDING WIRE
摘要 <p>PURPOSE:To produce a ball on the center line of a wire by completing an inactive gas atmosphere at a wire tip using a little amount of jet streams without contact to the air to prevent oxidization. CONSTITUTION:After a semiconductor element 8 and a case 9 are connected with each other, both a capillary 1 and a wire 3 are made to rise and simultaneously Ar gas is sent from a tube 6 to a cylinder 7 to discharge it from upper and lower openings 7a and produce an Ar atmosphere at a space 7b with a little amount of jet steams. The cylinder 7 is made to rise behind the capillary 1, the capillary 1 and the wire tip are disposed in the inside of the cylinder, an electrode 4 is simultaneously advanced and made to position right under the wire tip to produce a ball 3a. The surface of the ball 3a is not oxidized and the ball 3a is formed on the center line of the wire, because there is a little amount of jet streams of Ar gas. Next, if the electrode 4 is made to retreat, the cylinder 7 falls behind the capillary 1, thereby connecting the element 8 and the case 9 again. This constitution allows defective connection or scratches on the electrode surface of the element to be prevented.</p>
申请公布号 JPS60227432(A) 申请公布日期 1985.11.12
申请号 JP19840084437 申请日期 1984.04.26
申请人 NIPPON DENKI KK 发明人 SAKURAI KEIZOU
分类号 H01L21/60;B23K20/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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