| 摘要 |
Epoxy resin compositions including an epoxy resin, a hardener and an additive containing a rust preventing film forming component are provided. The additive is lanolin and/or a lanolin derivative. Optionally, the composition also includes a secondary additive selected from organosilicon compounds, organoaluminum compounds, organotitantium compounds, organotin compounds, liquid rubber having functional groups at both ends of the molecule, petroleum lubricating oils or Japan wax. These epoxy resin compositions, when used as encapsulating materials, prevent moisture and impurities from invading the surface of the device.
|
