发明名称 |
Printed circuit board maximizing areas for component utilization |
摘要 |
A multilayer printed circuit board for TTL logic components provides an approximate 100 ohm characteristic impedance between external microstrip signal lines and internal ground and voltage planes. The addition of two internal microstrip signal plane lines permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristic.
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申请公布号 |
US4553111(A) |
申请公布日期 |
1985.11.12 |
申请号 |
US19830527841 |
申请日期 |
1983.08.30 |
申请人 |
BURROUGHS CORPORATION |
发明人 |
BARROW, MICHAEL |
分类号 |
H01P3/08;H05K1/00;H05K1/02;H05K3/42;H05K3/46;(IPC1-7):H01P5/00 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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