发明名称 ULTRASONIC WIRE BONDING HEAD
摘要 PURPOSE:To obtain a wire bonding head with high reliability by clamping wire with a combination of a driving roller and a pressing roller and by driving the driving roller through a pulse motor for supplying wire. CONSTITUTION:When ultrasonic waves are applied to a wedge 8 for bonding a wire 9, a piezoelectric element 10 is shurnk by applying a voltage thereto, whereby an arm 14b is turned around the axis 15 and rollers 12, 13 are separated from each other. The wedge 8 is shifted to draw out the wire 9. The voltage applied to the element 10 is turned OFF when the wedge descends to be bonded. The element 10 is thereby returned to the original state and the arm 14b is turned reversely so that the wire 9 is clamped between the rollers 12 and 13. The wedge 8 is lifted up in this condition. The roller 12 is driven by a pulse motor 11 upon cutting the wire so that further wire 9 is delivered in accordance with the angle of rotation of the roller. The tip of the wire is presented to the tip of the wedge to prepare for the next bonding operation. Usage of the piezoelectric element enables the wire bonder to operate rapidly, and a bonding head with a simple construction and high reliability can be obtained.
申请公布号 JPS60227433(A) 申请公布日期 1985.11.12
申请号 JP19840084444 申请日期 1984.04.26
申请人 NIPPON DENKI KK 发明人 HAGA AKIRA
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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