| 摘要 |
PURPOSE:To enable the exposure of the entire surface of a circular semiconductor wafer by a method wherein a plurality of divided wafer-fixing fittings the respective inside of which is curved along the peripheral edge of the wafer and the respective height of which is made substantially the same with the thickness of the wafer are arranged movably forward and backward. CONSTITUTION:A plurality of divided wafer-fixing fittings 24 are mounted on a wafer support 21 for supporting a circular semiconductor wafer 23. The inside of each fixing fitting 24 facing that of the opposite one is formed to be a curved surface substantially along the peripheral edge of the wafer 23, each fitting having two legs projecting downward, and the height of each fitting being made substantially the same with the thickness of the wafer 23 to be positioned inside the fittings. Moreover, slender holes 22 into which the legs are inserted are made radially in the wafer support 21, and each fixing fitting 24 with the legs inserted into the holes can be moved forward and backward in relation to the central part of the support by using a screw 25 and a fixing nut 26 provided on the support 21. According to this construction, exposure can be applied to the entire surface of the wafer 23, and dust or the like is not produced, since the surface of the wafer 23 does not contact with the fixing fittings 24. |
