发明名称 MOS Isolation processing
摘要 A process for growing field oxide regions in an MOS circuit. An initial thermally grown layer of silicon nitride seals the substrate surface and reduces lateral oxidation, or bird's beak formation along the substrate-nitride interface. Field oxidation takes place in two steps, with the first step being a dry oxidation in HCL and the second taking place in steam.
申请公布号 US4551910(A) 申请公布日期 1985.11.12
申请号 US19840675128 申请日期 1984.11.27
申请人 INTEL CORPORATION 发明人 PATTERSON, ELIZABETH L.
分类号 H01L21/76;H01L21/316;H01L21/318;H01L21/32;H01L21/762;(IPC1-7):H01L21/76;H01L21/94 主分类号 H01L21/76
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