A method of forming semiconductor devices wherein a continuous metallic sheet is cut under computer control into a personalized lead pattern. The pattern is then moved to a bonding station. A bonding tool actuated by computer control moves from one terminal end to another to sequentially bond terminals to the semiconductor device. A variety of various patterns and chips can be handled on the same line using common cutting and bonding tools. A second bond can be made from the lead pattern to either a lead frame or a substrate.
申请公布号
US4551912(A)
申请公布日期
1985.11.12
申请号
US19850718817
申请日期
1985.04.01
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
MARKS, ROBERT;PHELPS, JR., DOUGLAS W.;SAMUELSEN, SIGVART J.;WARD, WILLIAM C.