CERAMIC PACKAGE WITH HEAT SINK

摘要

PURPOSE:To prevent a heat sink from peeling off as well as a ceramic sheet from cracking by a method wherein a heat sink made of copper-tungsten materials is bonded on the other surface of a ceramic sheet provided with a chip loading part, input/output terminals and a connecting pad on one surface thereof. CONSTITUTION:A recessed loading part 4 is provided on the almost central lower surface as one surface of a ceramic flat sheet 2 while a connecting pad 6 connecting input/output terminals 5 to a chip are provided around the periphery of loading part 4 to be electrically connected through the surface or inner layer. A heat sink 3 formed smaller than upper surface as the other surface of ceramic flat sheet 2 forming the bottom surface thereof is bonded into one body by means of bonding if on the position opposing to the chip loading part 4 on the upper surface using heat sink bonding material 7. This heat sink 3 made of copper-tungsten materials with almost the same coefficient of linear expansion as that of the ceramic flat sheet 2 may be formed into the shape with comb-type section of heat dissipating fins projecting upward.