| 摘要 |
PURPOSE:To form a practical and easily realized method for accurately evaluating purity of substrate by previously obtaining correlation between contamination concentration and strength of close contactness of substrate and thereafter measuring strength of close contactness between substrate and conductor thereon. CONSTITUTION:A relation between the remaining amount of Cl ion and bonding strength of substrate is previously otbained by executing water drop test or humidity bias test using, for example, the solution having known Cl ion concentration for a sample to be tested. The test of bonding strength of conductor is carried out for the substrates of the same kind, the remaining amount of Cl ion of substrate is estimated utilizing said relation from the result of such test. Thereby, cleanliness of substrate can be evaluated. It is also possible to foresee the reliability of substrate by utilizing the relation between cleanlines of substrate and reliability of substrate which has been obtained, from the cleanlines of substrate thus evaluated. |
