发明名称 PRODUCTION OF ALUMINUM SPOT LEAD FRAME
摘要 PURPOSE:To provide simplification of a stage and a reduction of cost by forming an Al film only to the required point of a metallic substrate by a laser beam while passing a plating gas contg. Al then blanking the substrate to a prescribed pattern. CONSTITUTION:The beam 5 generated by a laser oscillator 1 enters a vessel 11 through a transmission window 4 regulated by an output regulator 2 and irradiated to an Fe-Ni alloy bar 8 as a substrate. The beam 5 is moved by a scanning device 3 so as to be irradiated to the prescribed position of the bar 8 which is the substrate. The inside of the vessel 11 is evacuated to a vacuum through an evacuating hole 10 and the plating gas such as Al(CH3) or the like is introduced therein through a gas introducing port 9. The film consisting of Al is formed on the bar 8 subjected to the laser irradiation and thereafter the bar 8 is blanked to a prescirbed pattern, by which the lead frame is obtd. The stage for masking and removing the Al by dissolution is thus eliminated, by which the stage is simplified and the cost is reduced.
申请公布号 JPS60224785(A) 申请公布日期 1985.11.09
申请号 JP19840080634 申请日期 1984.04.20
申请人 HITACHI DENSEN KK 发明人 YONEMOTO TAKAHARU;OONUKI MITSUAKI;MIYAKE YASUHIKO
分类号 B23K26/00;B23K26/38;C23C16/48 主分类号 B23K26/00
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