| 摘要 |
The invention provides a process for mounting an ultra-high frequency diode so as to form a pre-matched module. The module of the invention comprises a copper base, a quartz ring and a copper cover: these three parts, coated with gold at least on their facing faces, are assembled together by thermocompression. Inside this case, the diode chip, soldered to the base via a gold heat sink is biased by a false "beam-lead" connection, a metal star whose arms are curved, which reduces the inductance and capacity of this connection with respect to the base. The false "beam-lead" is formed by metalizing a mesa obtained on a silicon wafer. |
