发明名称 METHOD AND DEVICE FOR CUTTING BY SAW BY UTILIZING LASER
摘要 A method and apparatus for eliminating chipping at the exit surface of a saw blade through material such as wood or the like, the apparatus including a laser source emitting a laser beam which is focused to provide one or more grooves at the surface of the wood in general alignment with the line of cut in advance thereof. In a first embodiment a single groove is formed by a focused laser beam at a spot just ahead of the saw blade which may be positioned for one edge of the teeth thereof cutting through the center of the groove to produce one finished cut edge. In the other embodiments, two focused beams are created from a single beam for producing parallel grooves at a width approximating the width of cut of the saw blade to produce finished edges on both sides of the saw cut.
申请公布号 JPS60223684(A) 申请公布日期 1985.11.08
申请号 JP19840073942 申请日期 1984.04.14
申请人 JIYON ARAN MATSUKEN 发明人 JIYON ARAN MATSUKEN
分类号 B23K26/00;B23K26/067;B23K26/40;B27B5/00;B27G19/10 主分类号 B23K26/00
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