| 摘要 |
PURPOSE:To obtain a leadless chip carrier which is enhanced in heat sink and readily grounded with a mounting by mounting a die on the bottom of high melting point metal having excellent thermal conductivity of a semiconductor chip, and mounting the bottom by soldering on a substrate. CONSTITUTION:A bottom 13 is made of metal such as molybdenum or tungsten which has high melting point and good thermal conductivity as compared with silver brazing material 19. A grounding terminal 21 is provided as a ground at a substrate disposed under a semiconductor chip 15. The mounting is not only readily performed in the same manner as the conventional technique, but the bottom 13 is grounded by the terminal 21 to be extremely simplified in the grounding method. The heat generated at the chip 15 is absorbed to the bottom 13, and since the bottom 13 is made of a metal having good thermal conductivity, the heat is transmitted through the bottom 13 and the solder 20b directly to the substrate to improve the heat sink. |
