发明名称 |
SOLDER MATERIAL |
摘要 |
PURPOSE:To provide a solder material which enables soldering of parts having low heat resistance by adding a coloring pigment for increasing absorptivity of light to pasty cream solder consisting of powder solder and flux. CONSTITUTION:The solder material is prepd. by adding the coloring pigment having the effect of increasing the absorptivity of light to the pasty cream solder prepd. by mixing the powder solder and flux. When electronic parts are soldered to a printed board by using such solder material, the cream solder can be melted before the temp. of the parts rises too much. The soldering of the electric parts having low heat resistance is thus made possible. |
申请公布号 |
JPS60223695(A) |
申请公布日期 |
1985.11.08 |
申请号 |
JP19840078876 |
申请日期 |
1984.04.19 |
申请人 |
MATSUSHITA DENKI SANGYO KK |
发明人 |
SAITOU SUSUMU;MATSUDA CHIYUUICHI |
分类号 |
B23K35/22;H05K3/34;(IPC1-7):B23K35/22 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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