| 摘要 |
PURPOSE:To obtain a light emittig device characterized by excellent reliability and high productivity, by sealing a light emitting element by using a specified epoxy resin composition, and quickly hardening the resin in the inside. CONSTITUTION:A light emitting element is sealed by an epoxy resin composition, whose essential components are as follows: epoxy resin; aluminum compound; silicon compound, which forms silanol by light; compound including iodine or compound including sulfur, which forms Lewis acid by light; and silicon compound, which forms silanol by heating. The amount of inclusion of the aluminum compound is 0.001-10wt% with respect to the epoxy resin. The desirable amount is in the range of 0.05-5wt%. The amount of inclusion of the silicon compound is 0.1-20wt% with respect to the epoxy resin. The desirable amount is in the range of 1-10wt%. |
