| 摘要 |
PURPOSE:To effectively utilize substantially the entire area of a semiconductor substrate by using a mask having alignment marks provided corresponding to four or more optical lens systems and using combinations of arbitrary two systems. CONSTITUTION:Four or more optical lens systems and a mask having alignment marks corresponding to the systems are used to align with the mask alignment in combination of arbitrary two systems of the lens systems and the marks. For example, the four alignment optical systems and a mask having four alignment marks 42 corresponding to the optical systems are used. Any two marks 42 of the four marks 42 are used to perform a mask alignment. Thus, a chip 52 can be formed on the entire surface of a semiconductor substrate 51 without waste. |
