| 摘要 |
PURPOSE:To cut a semiconductor device from an outer frame safely without damaging the semiconductor device, by cutting a part, which is to be cut from the lead frame for the semiconductor device by laser. CONSTITUTION:A semiconductor 7 is connected to a lead frame 10 by the tips of leads 9, a tie bar 11 and tab leads 12 before the semiconductor is individually separated. A mask 13 is supported by a mask supporting body 15. The semiconductor 7, which is connected to the lead frame 7, is conveyed by a conveying device so that the specified position of a mounting table 16, i.e., a part of the semiconductor device 7 that is to be cut from the lead frame 10, corresponds to each of a plurality of windows 14 of the mask 13. Then laser light is emitted from a laser emitting part 17. The laser emitting part 17 scans a scanning path in the direction of an arrow. A plurality of the semiconductor devices, which are connected to the lead frame are cut into the individual semiconductor device. |
