| 摘要 |
<p>PURPOSE:To prevent overlocking of the same defect by feeding chips at every other one or two pieces of multireticules to decrease pitch deviation and to improve exposing accuracy and detecting defects by comparing the chips with each other. CONSTITUTION:The chips in the 2nd line shown by C and A are inspected. The probability that the same defect as the defect of the chip C owing not to the dust, etc. existing to the reticule exist at the part corresponding the chip A is nearly equal to zero and therefore the inspection of the defect can be made more exactly. The chips are fed at the pitch of every one or two pieces at 1-step intervals in the direction Y and 2-step intervals in the direction X, by which the runout and pitch deviation are decreased and the exposing accuracy is improved in exposing of the photomask or wafer formed with 4 or 9 pieces of the IC patterns in the above-mentioned way; in addition, the effect of preventing the overlooking of the same defect by the defect detection using the automatic surface inspecting device which makes detection by comparing the chips with each other is provided.</p> |
