| 摘要 |
PURPOSE:To wipe off a treating liquid and a washing liquid in a preprocess adhering on a substrate for a semiconductor positively, and to prevent the generation of dust on drying by pulling up the semiconductor substrate at slow speed from the washing liquid while being slightly rocked and making dried air to collide against the substrate. CONSTITUTION:Semiconductor substrates 20 are set to a carrier 21, a motor for a rest 7 is driven, the carrier 21 is lowered in a washing liquid tank 25, and a movable base 8 is descended until the semiconductor substrates 20 are dipped uniformly in a washing liquid. The carrier 21 is pulled up at slow speed from the washing liquid and extracted while reciprocating the substrate 20 for the semiconductor by rocking a rocking bar 12 being in contact with said substrate 20 for the semiconductor, dried air from a blower 31 is made to collide against the substrate when being pulled up, and the washing liquid is wiped off.
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