Copper alloys for integrated circuit leads

摘要

The invention provides copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The alloy comprises copper and from 0.05 to 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In a preferred embodiment 0.01 to 3% by weight % of iron is also added. An improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening.