| 摘要 |
PURPOSE:To prevent the mutual bonding of terminal electrodes by attaching non-conductive non-water soluble inorganic powder to the surfaces of the terminal electrodes. CONSTITUTION:Powder 3, which comprises at least one kind of MgO, Al2O3 or SiO2, which is formed to not more than 1mum grain size and adhesion thereof is facilitated, is attached to the surfaces of terminal electrodes 3 for a part 1. The electrode 3 is manufactured normally by plating Cu or Ni onto an alloy of Ag and Pd or Ag. In the magazine packaging of chip parts, accidents of which electronic parts are mutually bonded lightly and suctions by nozles are made unable can be avoided by the adhesion of the powder, and defective mounting to a substrate of the chip electronic parts can be prevented.
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